Conference proceeding
Circuit Parameter Independent Test Pattern Generation for Interconnect Open Defects
2014 IEEE 23rd Asian Test Symposium, pp.131-136
11/2014
DOI: 10.1109/ATS.2014.34
Abstract
Open defects such as interconnect opens are known to be one of the predominant defects in nanoscale technologies. Yet, test pattern generation for open defects is challenging because of the high number of parameters which need to be considered. Additionally, the assumed values of these parameters may vary due to process variations reducing fault coverage of a test set generated under this assumption. This paper presents a new ATPG approach for circuit Parameter independent (CPI) tests. In addition a definition of oscillation free CPI tests is given. The generated tests are robust against process variations affecting the influence of neighboring interconnects as well as trapped charge and prohibit oscillating behavior. Experimental results show the high efficiency of the new approach, generating CPI tests for circuits with over 500k nonequivalent faults and several thousand aggressors.
Details
- Title: Subtitle
- Circuit Parameter Independent Test Pattern Generation for Interconnect Open Defects
- Creators
- Dominik Erb - University of FreiburgKarsten Scheibler - University of FreiburgMatthias Sauer - University of FreiburgSudhakar M Reddy - University of IowaBernd Becker - University of Freiburg
- Resource Type
- Conference proceeding
- Publication Details
- 2014 IEEE 23rd Asian Test Symposium, pp.131-136
- Publisher
- IEEE
- DOI
- 10.1109/ATS.2014.34
- ISSN
- 1081-7735
- eISSN
- 2377-5386
- Language
- English
- Date published
- 11/2014
- Academic Unit
- Electrical and Computer Engineering
- Record Identifier
- 9984197307902771
Metrics
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