Conference proceeding
Multi-cycle Circuit Parameter Independent ATPG for interconnect open defects
2015 IEEE 33rd VLSI Test Symposium (VTS), Vol.2015-, pp.1-6
04/2015
DOI: 10.1109/VTS.2015.7116296
Abstract
Interconnect opens are known to be one of the predominant defects in nanoscale technologies. Generating tests to detect such defects is challenging due to the need to accurately determine the coupling capacitances between the open net and its aggressors and fix the state of these aggressors during test. Process variations cause deviations from assumed values of circuit parameters thus potentially invalidating tests generated with assumed circuit parameters. Additionally, recent investigation using test chips showed that the steady state voltage on open nets may drift slowly with the application of circuit inputs and can be different at different nets.
Details
- Title: Subtitle
- Multi-cycle Circuit Parameter Independent ATPG for interconnect open defects
- Creators
- Dominik Erb - University of FreiburgKarsten Scheibler - University of FreiburgMatthias Sauer - University of FreiburgSudhakar M Reddy - University of IowaBernd Becker - University of Freiburg
- Resource Type
- Conference proceeding
- Publication Details
- 2015 IEEE 33rd VLSI Test Symposium (VTS), Vol.2015-, pp.1-6
- Publisher
- IEEE
- DOI
- 10.1109/VTS.2015.7116296
- ISSN
- 1093-0167
- eISSN
- 2375-1053
- Language
- English
- Date published
- 04/2015
- Academic Unit
- Electrical and Computer Engineering
- Record Identifier
- 9984197063502771
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