Conference proceeding
On Achieving Maximal Chain Diagnosis Resolution through Test Pattern Selection
2016 IEEE 25th Asian Test Symposium (ATS), pp.132-137
11/2016
DOI: 10.1109/ATS.2016.22
Abstract
Scan chain diagnosis plays an important role in silicon debug and yield ramp-up since 10% to 30% of chip failures are caused by scan chain failures. Failure data collected on testers is limited by buffer sizes to capture the failing responses from scan chains, especially since scan chain failures produce a large amount of failing responses. In this paper, we propose a new pattern selection method to maximize the chain diagnosis resolution when limited failure information is collected from the tester. Experimental results on industrial designs show our method achieves higher diagnosis resolution than previous method.
Details
- Title: Subtitle
- On Achieving Maximal Chain Diagnosis Resolution through Test Pattern Selection
- Creators
- Xijiang Lin - Mentor GraphicsSudhakar M Reddy - University of IowaWu-Tung Cheng - Mentor Graphics
- Resource Type
- Conference proceeding
- Publication Details
- 2016 IEEE 25th Asian Test Symposium (ATS), pp.132-137
- DOI
- 10.1109/ATS.2016.22
- ISSN
- 1081-7735
- eISSN
- 2377-5386
- Publisher
- IEEE
- Language
- English
- Date published
- 11/2016
- Academic Unit
- Electrical and Computer Engineering
- Record Identifier
- 9984197164202771
Metrics
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