Piezoelectric array for transducer application using additive manufacturing

Zeyu Chen; Qiangguo Jiang; Xuan Song; Kexin Wang; Shanghua Wu; Qifa Zhou; Yong Chen; Kirk Shung

doi:10.1109/ULTSYM.2017.8092617

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Conference proceeding

Piezoelectric array for transducer application using additive manufacturing

Zeyu Chen, Qiangguo Jiang, Xuan Song, Kexin Wang, Shanghua Wu, Qifa Zhou, Yong Chen and Kirk Shung

2017 IEEE International Ultrasonics Symposium (IUS), pp.1-4

09/2017

DOI: 10.1109/ULTSYM.2017.8092617

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Abstract

Piezoelectric ceramic and the corresponding array are widely used in energy harvesting and ultrasonic application for the capabilities of converting compressive/tensile stresses to an electric charge, or vice versa. However, the need for a complex geometry of array is a major technical challenge for further application. To enable the fabrication of piezoelectric ceramics, additive manufacturing (AM) processes (3D printing technology) is expect. In this study, we propose a Mask-Image-Projection-based Stereolithography (MIP-SL) technology to print piezoelectric-composite slurry with BaTiO 3 particles into different arrays. After post-process, the printed arrays display piezoelectric properties that can be used in ultrasonic application.

Fabrication

piezoelectric ceramic

Ultrasonic imaging

additive manufacturing

Three-dimensional printing

Ceramics

Stereolithography

Slurries

ultrasonic transducer

Optical arrays

Details

Title: Subtitle: Piezoelectric array for transducer application using additive manufacturing
Creators: Zeyu Chen - Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Qiangguo Jiang - Sch. of Electro-Mech. Eng., Guangdong Univ. of Technol., Guangzhou, China
Xuan Song - Coll. of Eng., Univ. of Iowa, Iowa City, IA, USA
Kexin Wang - Int. Dept., South China Normal Univ., Guangzhou, China
Shanghua Wu - Sch. of Electro-Mech., Guangdong Univ. of Technol., Guangzhou, China
Qifa Zhou - Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Yong Chen - Epstein Dpartment of Ind. & Syst. Eng., Univ. of Southern California, Los Angeles, CA, USA
Kirk Shung - Dept. of Biomed. Eng., Univ. of Southern, Los Angeles, CA, USA
Resource Type: Conference proceeding
Publication Details: 2017 IEEE International Ultrasonics Symposium (IUS), pp.1-4
DOI: 10.1109/ULTSYM.2017.8092617
eISSN: 1948-5727
Publisher: IEEE
Language: English
Date published: 09/2017
Academic Unit: Industrial and Systems Engineering; Injury Prevention Research Center; Mechanical Engineering
Record Identifier: 9984064557602771

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