Conference proceeding
Rapid and minimally invasive quantum cascade wafer testing
Proceedings of SPIE, Vol.7230(1), pp.72300T-72300T-8
Novel In-Plane Semiconductor Lasers VIII
02/12/2009
DOI: 10.1117/12.810258
Abstract
Quantum Cascade (QC) wafer quality testing requires intensive processing and characterization. Here, we demonstrate a minimally invasive technique that gives rapid feedback on wafer quality. A mesa is fabricated using only a single etch and metallization step. The device is electrically pumped and optically and electrically characterized. The peak wavelength position and the full width at half maximum (FWHM) as a function of applied electric field, turn-on voltage, maximum operating current density and threshold current density of the mesas are measured. Results of the mesa and lasers processed from the same wafer are compared and differed by less than 10 %.
Details
- Title: Subtitle
- Rapid and minimally invasive quantum cascade wafer testing
- Creators
- Ekua N Bentil - Princeton UniversityFatima Toor - Princeton UniversityAnthony J Hoffman - Princeton UniversityMatthew D Escarra - Princeton UniversityClaire F Gmachl - Princeton University
- Resource Type
- Conference proceeding
- Publication Details
- Proceedings of SPIE, Vol.7230(1), pp.72300T-72300T-8
- Conference
- Novel In-Plane Semiconductor Lasers VIII
- DOI
- 10.1117/12.810258
- ISSN
- 0277-786X
- Language
- English
- Date published
- 02/12/2009
- Academic Unit
- Holden Comprehensive Cancer Center; Iowa Technology Institute; Physics and Astronomy; Electrical and Computer Engineering
- Record Identifier
- 9984197166402771
Metrics
4 Record Views