Journal article
Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive
Journal of applied polymer science, Vol.92(6), pp.3843-3856
06/15/2004
DOI: 10.1002/app.20403
Abstract
The adhesion mechanism between polyimides and aromatic thermosetting copolyester (ATSP) involved in the solid-state bonding technique using submicrometer ATSP coatings was evaluated. The adhesion strength at the interface between ATSP and polyimide is strongly related to the diffusion of ATSP into the polyimide base layer. We used dynamic secondary ion mass spectrometry to study the interface width between deuterated ATSP and polyimides and found that the interface between ATSP and poly(4,4′-diphenylether pyromellitimide) (PMDA-ODA) is wider than the interface between ATSP and poly(p-phenylene biphenyltetracarboximide) (BPDA-PPD) because of the less rigid chain in the PMDA-ODA. By partially curing both polyimides, the interface width was greatly increased, which could lead to an improved adhesion at the interface between polyimide BPDA-PPD and ATSP. © 2004 Wiley Periodicals, Inc.
Details
- Title: Subtitle
- Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive
- Creators
- Kun Xu - University of Illinois Urbana-ChampaignJohn C. Selby - University of Illinois Urbana-ChampaignMark A. Shannon - University of Illinois Urbana-ChampaignJames Economy - University of Illinois Urbana-Champaign
- Resource Type
- Journal article
- Publication Details
- Journal of applied polymer science, Vol.92(6), pp.3843-3856
- DOI
- 10.1002/app.20403
- ISSN
- 0021-8995
- eISSN
- 1097-4628
- Publisher
- Wiley Subscription Services, Inc., A Wiley Company
- Number of pages
- 14
- Language
- English
- Date published
- 06/15/2004
- Academic Unit
- Roy J. Carver Department of Biomedical Engineering; Dermatology
- Record Identifier
- 9984296305902771
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