Journal article
Biaxial testing of nanoscale films on compliant substrates: Fatigue and fracture
Review of scientific instruments, Vol.73(8), pp.2963-2970
08/2002
DOI: 10.1063/1.1488685
Abstract
Two problems of technological importance for microelectromechanical systems (MEMS) and microelectronics industry are addressed: fatigue of thin films and nanoscale film cracking. A device is described that can (1) conduct biaxial fatigue tests on thin films and (2) be utilized to study fracture patterns in nanoscale coatings under biaxial stress state. Thin-film specimens, in the form of circular membranes, are exposed to cyclic pressures between two fixed pressure limits. Corresponding pressure and specimen deflection are measured. Experimental results, including hysteresis loops spanning deflections of 15–50 μm are presented for 4.6-μm-thick polyimide films. Furthermore, the evolution of crack patterns in a 150-nm-thick Al film deposited on a polyimide substrate is studied. Critical mode I stress intensity factor for Al is extracted from experimental results.
Details
- Title: Subtitle
- Biaxial testing of nanoscale films on compliant substrates: Fatigue and fracture
- Creators
- B. Erdem Alaca - Department of Mechanical and Industrial Engineering, University of Illinois, 1206 West Green Street, Urbana, Illinois 61801John C Selby - Department of Mechanical and Industrial Engineering, University of Illinois, 1206 West Green Street, Urbana, Illinois 61801M. T. A Saif - Department of Mechanical and Industrial Engineering, University of Illinois, 1206 West Green Street, Urbana, Illinois 61801Huseyin Sehitoglu - Department of Mechanical and Industrial Engineering, University of Illinois, 1206 West Green Street, Urbana, Illinois 61801
- Resource Type
- Journal article
- Publication Details
- Review of scientific instruments, Vol.73(8), pp.2963-2970
- DOI
- 10.1063/1.1488685
- ISSN
- 0034-6748
- eISSN
- 1089-7623
- Number of pages
- 8
- Grant note
- FG02-96ER-4539 / DOE
- Language
- English
- Date published
- 08/2002
- Academic Unit
- Roy J. Carver Department of Biomedical Engineering; Dermatology
- Record Identifier
- 9984025564902771
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