Journal article
Dislocation density-based modeling of subsurface grain refinement with laser-induced shock compression
Computational materials science, Vol.53(1), pp.79-88
2012
DOI: 10.1016/j.commatsci.2011.08.038
Abstract
► We model microstructural evolution during LSP using a dislocation density model. ► An FE model is used to simulate the repetitive passes of the LSP process. ► We model the dislocation density and dislocation cell size achieved by LSP. ► Predicted residual stress and microhardness match well with the experimental data.
Laser shock peening (LSP) is an innovative surface treatment technique applied to improve the mechanical properties and surface microstructures of metallic components. This paper is concerned with prediction of the microstructural evolution of metallic components subjected to single or multiple LSP impacts. A numerical framework is developed to model the evolution of dislocation density and dislocation cell size using a dislocation density-based material model. It is shown that the developed model captures the essential features of the material mechanical behaviors and predicts that the total dislocation density reaches the order of 10
14
m
−2 and a minimum dislocation cell size is below 250
nm for LSP of monocrystalline coppers using the laser energy density on the order of 500
GW/cm
2. It is further shown that the model is cable of predicting the material strengthening mechanism in terms of residual stress and microhardness of the LY2 aluminum alloy due to grain refinement in a LSP process with less laser energy densities on the order of several GW/cm
2.
Details
- Title: Subtitle
- Dislocation density-based modeling of subsurface grain refinement with laser-induced shock compression
- Creators
- Hongtao DingYung C Shin
- Resource Type
- Journal article
- Publication Details
- Computational materials science, Vol.53(1), pp.79-88
- Publisher
- Elsevier B.V
- DOI
- 10.1016/j.commatsci.2011.08.038
- ISSN
- 0927-0256
- eISSN
- 1879-0801
- Language
- English
- Date published
- 2012
- Academic Unit
- Mechanical Engineering
- Record Identifier
- 9984064586102771
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