Journal article
Influence of Active Application and Etching Mode on Enamel Bond Strength and Surface Free Energy of a Universal Adhesive
The Japanese Journal of Conservative Dentistry, Vol.63(6), pp.494-502
2020
DOI: 10.11471/shikahozon.63.494
Abstract
Purpose: The purpose of this study was to investigate the influence of active application and etching mode on the enamel bond performance of a universal adhesive based on shear bond strength (SBS) tests and surface free-energy (SFE) measurements. Materials and Methods: A universal adhesive, Clearfil Universal Bond Quick (CU, Kuraray Noritake Dental), was used. Bovine enamel surfaces were ground with silicon carbide papers, ending at #400-grit. The prepared enamel specimens were divided into four groups following surface treatment: (1) etch-&-rinse mode with active application; (2) etch-&-rinse mode with inactive application; (3) self-etch mode with active application; (4) self-etch mode with inactive application. Ten bonded specimens per group were stored in 37°C water for 24 h, and then SBS tests were performed. The SEF of the enamel surfaces with different application modes was measured after rinsing with acetone and water. Representative treated enamel surfaces were observed with a scanning electron microscope (SEM). One-way ANOVA followed by Tukey’s honestly significant difference test (α=0.05) was performed for analysis of the SBS and SFE data. Results: The SBS values in etch-&-rinse mode were significantly higher than those in self-etch mode regardless of with or without active application. On the other hand, there were no significant differences in SBS between the active and inactive application groups. For baseline, the enamel surface after phosphoric acid etching showed a significantly higher total SFE value than the initial (just ground) enamel surface. A reduction in total SFE was observed for the active application groups compared with the inactive application groups. From the SEM observations, although typical etching patterns were observed in etch-&-rinse mode, the spicular etching pattern appeared to be collapsed in active application. Conclusion: The results of this study indicated that the SBS values of the universal adhesive tested were significantly higher in etch-&-rinse mode than in self-etch mode, regardless of the adhesive application mode. Regarding the SFE, the universal adhesive showed higher polar force in etch-&-rinse mode than in self-etch mode.
Details
- Title: Subtitle
- Influence of Active Application and Etching Mode on Enamel Bond Strength and Surface Free Energy of a Universal Adhesive
- Creators
- Arisa Imai - Department of Operative Dentistry, Nihon University School of DentistryToshiki Takamizawa - Department of Operative Dentistry, Nihon University School of DentistryTomohiko Tamura - Department of Operative Dentistry, Nihon University School of DentistryHiroshi Takamiya - Department of Operative Dentistry, Nihon University School of DentistryKengo Wakamatsu - Department of Operative Dentistry, Nihon University School of DentistryAkimasa Tsujimoto - Department of Operative Dentistry, Nihon University School of DentistrySoshi Suzuki - Department of Operative Dentistry, Nihon University School of DentistryMiho Suzuki - Department of Operative Dentistry, Nihon University School of DentistryMasashi Miyazaki - Department of Operative Dentistry, Nihon University School of Dentistry
- Resource Type
- Journal article
- Publication Details
- The Japanese Journal of Conservative Dentistry, Vol.63(6), pp.494-502
- Publisher
- The Japanese Society of Conservative Dentistry
- DOI
- 10.11471/shikahozon.63.494
- ISSN
- 0387-2343
- eISSN
- 2188-0808
- Language
- Japanese
- Date published
- 2020
- Academic Unit
- Operative Dentistry
- Record Identifier
- 9984176688402771
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