Journal article
Rapid and Minimally Invasive Quantum Cascade Wafer Testing
IEEE photonics technology letters, Vol.21(8), pp.531-533
04/15/2009
DOI: 10.1109/LPT.2009.2014392
Abstract
In this work, we demonstrate a rapid and minimally invasive technique for wafer quality testing, which requires using a single etch and metallization step to fabricate a single mesa. The mesa's electrical and optical properties are characterized and compared with those of a quantum cascade (QC) laser made from the same wafer, to test the validation of our method. This technique is ideal for determining key QC laser parameters and also the level of agreement between a design and actual laser performance without requiring laser processing which can be highly invasive, labor intensive, and time consuming. Measurements between these mesas and actual reference lasers made from the same wafer material differed by less than ~10% in parameters such as emission wavelength, full-width at half-maximum, turn-on voltage, and maximum operating current density, thus proving the adequacy of our technique.
Details
- Title: Subtitle
- Rapid and Minimally Invasive Quantum Cascade Wafer Testing
- Creators
- E.N Bentil - Princeton UniversityF Toor - Princeton UniversityA.J Hoffman - Princeton UniversityM.D Escarra - Princeton UniversityC.F Gmachl - Princeton University
- Resource Type
- Journal article
- Publication Details
- IEEE photonics technology letters, Vol.21(8), pp.531-533
- Publisher
- IEEE
- DOI
- 10.1109/LPT.2009.2014392
- ISSN
- 1041-1135
- eISSN
- 1941-0174
- Language
- English
- Date published
- 04/15/2009
- Academic Unit
- Physics and Astronomy; Electrical and Computer Engineering; Iowa Technology Institute; Holden Comprehensive Cancer Center
- Record Identifier
- 9984197064302771
Metrics
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