Sub-micrometer solid-state adhesive bonding with aromatic thermosetting copolyesters for the assembly of polyimide membranes in silicon-based devices

J. C Selby; M. A Shannon; K XU; J Economy

doi:10.1088/0960-1317/11/6/308

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Sub-micrometer solid-state adhesive bonding with aromatic thermosetting copolyesters for the assembly of polyimide membranes in silicon-based devices

Journal article

Peer reviewed

Sub-micrometer solid-state adhesive bonding with aromatic thermosetting copolyesters for the assembly of polyimide membranes in silicon-based devices

J. C Selby, M. A Shannon, K XU and J Economy

Journal of micromechanics and microengineering, Vol.11(6), pp.672-685

2001

DOI: 10.1088/0960-1317/11/6/308

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Abstract

An adhesive bonding process is presented that utilizes sub-micrometer thick bondlines of all-aromatic thermosetting copolyesters (ATSP) for the assembly of polyimide membranes in silicon-based sensors and actuators. Due to the unique ability of ATSP to form void-free self-adhesive bonds through solid-state interchain transesterification reactions, sub-micrometer adhesive bonding technology offers new avenues for the precision assembly of high-performance, three-dimensional microscopic and mesoscopic devices. As a model process, PMDA-ODA polyimide membranes, 4-6 μm thick, are fabricated on glass carrier substrates, selectively bonded, transferred, and assembled on bulk-micromachined silicon substrates in the fabrication of mesoscopic circular diaphragm structures, 2-8 mm in diameter. Experimental load-deflection behavior of adhesively bonded polyimide diaphragms demonstrate that assembled membranes exhibit a tensile residual stress of 19 MPa, a value roughly equal to that measured for a PMDA-ODA polyimide film (derived from a thermally imidized polyamic acid precursor) deposited directly on silicon. Using a standard blister-type peel test, the debond energy range of an assembled polyimide membrane is shown to be 15-23 J m-2, approximately 15-25% of the debond energy measured for a PMDA-ODA polyimide film deposited directly on a silicon substrate with a native oxide surface.

Applied Sciences

Electronics

Exact sciences and technology

Lithography, masks and pattern transfer

Micro- and nanoelectromechanical devices (mems/nems)

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

Details

Title: Subtitle: Sub-micrometer solid-state adhesive bonding with aromatic thermosetting copolyesters for the assembly of polyimide membranes in silicon-based devices
Creators: J. C Selby - University of Illinois Urbana-Champaign
M. A Shannon - University of Illinois Urbana-Champaign
K XU - University of Illinois Urbana-Champaign
J Economy - University of Illinois Urbana-Champaign
Resource Type: Journal article
Publication Details: Journal of micromechanics and microengineering, Vol.11(6), pp.672-685
Publisher: Institute of Physics
DOI: 10.1088/0960-1317/11/6/308
ISSN: 0960-1317
eISSN: 1361-6439
Language: English
Date published: 2001
Academic Unit: Roy J. Carver Department of Biomedical Engineering; Dermatology
Record Identifier: 9984296213202771

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