Journal article
The role of the stagnant-film thickness in mesoscopic modeling of equiaxed grain envelopes
IOP conference series. Materials Science and Engineering, Vol.117(1), pp.012014-12019
2016
DOI: 10.1088/1757-899X/117/1/012014
Abstract
The mesoscopic envelope model overcomes the limitations of phase-field methods. It can be applied at larger scales and can include fluid flow at reasonable computing cost. It consists of the description of a dendritic grain by an envelope that links the active dendrite branches. The grain is modelled as an evolving porous medium and the liquid-solid phase change and solute transport are modelled by volume-averaged equations. The velocities of the dendrite tips are determined by the local solute-concentration field in the proximity of the envelope through an analytical stagnant-film model. In this publication, we present our implementation of the model for a binary alloy and we discuss the influence of the stagnant-film thickness, the principal model parameter, on the predicted 3D equiaxed grains by comparisons with the scaling laws for binary-alloy dendrites obtained in recent experiments by Melendez and Beckermann.
Details
- Title: Subtitle
- The role of the stagnant-film thickness in mesoscopic modeling of equiaxed grain envelopes
- Creators
- Youssef Souhar - Université de LorraineValerio De Felice - Université de LorraineMiha Založnik - Université de LorraineHervé Combeau - Université de LorraineChristoph Beckermann - University of Iowa
- Resource Type
- Journal article
- Publication Details
- IOP conference series. Materials Science and Engineering, Vol.117(1), pp.012014-12019
- DOI
- 10.1088/1757-899X/117/1/012014
- ISSN
- 1757-8981
- eISSN
- 1757-899X
- Publisher
- IOP Publishing
- Language
- English
- Date published
- 2016
- Academic Unit
- Mechanical Engineering
- Record Identifier
- 9984196532602771
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