Sign in
Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
Journal article   Peer reviewed

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C Beckermann, T. F Smith and B Pospichal
Journal of electronic packaging, Vol.116(2), pp.126-133
06/01/1994
DOI: 10.1115/1.2905500

View Online

Abstract

Details

Metrics

8 Record Views