Journal article
Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
Journal of electronic packaging, Vol.116(2), pp.126-133
06/01/1994
DOI: 10.1115/1.2905500
Abstract
A study is reported of heat transfer and air flow in an electronic module consisting of an array of narrowly spaced vertical circuit boards with highly-protruding components contained in a naturally vented chassis. A two-dimensional simulation model is developed that accounts for heat transfer by conduction, convection, and radiation, and sensitivity studies are performed. Experiments are conducted using a specially constructed test module. Comparisons with the experiments reveal the need to calibrate the model by selecting an effective component height that represents the drag properties of the actual three-dimensional component geometry. The need to account in the model for heat losses in the depth direction is also discussed. The importance of accurate thermophysical properties and of multi-dimensional radiation is shown. Good agreement with measured velocities and local board temperatures is obtained over a wide range of power levels, and it is concluded that the calibrated model is capable of representing the thermal behavior of the present module.
Details
- Title: Subtitle
- Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
- Creators
- C Beckermann - Department of Mechanical Engineering, The University of Iowa, Iowa City, Iowa 52242T. F Smith - Department of Mechanical Engineering, The University of Iowa, Iowa City, Iowa 52242B Pospichal - Air Transport Systems, Rockwell International Corporation, Cedar Rapids, Iowa 52498
- Resource Type
- Journal article
- Publication Details
- Journal of electronic packaging, Vol.116(2), pp.126-133
- Publisher
- ASME
- DOI
- 10.1115/1.2905500
- ISSN
- 1043-7398
- eISSN
- 1528-9044
- Language
- English
- Date published
- 06/01/1994
- Academic Unit
- Mechanical Engineering
- Record Identifier
- 9984064227202771
Metrics
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