Patent
Copper-assisted, anti-reflection etching of silicon surfaces
European Patent Office
10/28/2015
Abstract
A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.
Details
- Title: Subtitle
- Copper-assisted, anti-reflection etching of silicon surfaces
- Creators
- Fatima Toor (Inventor) - University of Iowa, Electrical and Computer EngineeringHoward M Branz (Inventor) - National Renewable Energy Laboratory
- Resource Type
- Patent
- Publisher
- European Patent Office
- Patent
- EP2828895; B1; European Patent Organisation (Germany, Munich) - EPO; Published; 13764428; 03/11/2013
- Translated title
- KUPFERGESTÜTZTE ANTIREFLEXIVE ÄTZUNG VON SILICIUMOBERFLÄCHEN; GRAVURE ANTIREFLET DE SURFACES DE SILICIUM ASSISTÉE PAR DU CUIVRE
- Alternative title
- KUPFERGESTÜTZTE ANTIREFLEXIVE ÄTZUNG VON SILICIUMOBERFLÄCHEN; GRAVURE ANTIREFLET DE SURFACES DE SILICIUM ASSISTÉE PAR DU CUIVRE
- Language
- English; French; German
- Date published
- 10/28/2015
- Academic Unit
- Physics and Astronomy; Holden Comprehensive Cancer Center; Electrical and Computer Engineering; Iowa Technology Institute
- Record Identifier
- 9984240055402771
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