Patent
Photopolymerizable compositions for encapsulating microelectronic devices
United States Patent and Trademark Office
08/08/2000
Abstract
A novel method for producing thick composite parts based upon photopolymerizable compositions is disclosed. Also disclosed are novel methods for encapsulation of microelectronic devices based upon novel photopolymerizable compositions. The constituents of the photopolymerizable mixture comprise a monomer or monomers capable of polymerizing by free radical or cationic mechanisms, and a photoinitiator system which possesses an absorbance characteristic which is effectively reduced, or self-eliminating, upon initiation of the polymerization reaction. Parts having thicknesses up to 2 cm and thicker for varying end use applications are made by photopolymerizing such compositions. In addition, using such compositions composite parts can be made using a reinforcement material such as a glass fiber mat present in an amount by weight of from about 5 to about 70%.
Details
- Title: Subtitle
- Photopolymerizable compositions for encapsulating microelectronic devices
- Creators
- Alec B Scranton (Inventor) - University of Iowa, Chemical and Biochemical EngineeringBharath Rangarajan (Inventor) - Michigan State UniversityKiran K Baikerikar (Inventor) - Michigan State University
- Contributors
- Board of Trustees operating Michigan State University (Assignee)
- Resource Type
- Patent
- Publisher
- United States Patent and Trademark Office; United States
- Patent
- US 6099783 A; United States Patent and Trademark Office (United States, Alexandria) - USPTO; Published; 09/130672; 08/07/1998
- Number of pages
- 35 pages
- Language
- English
- Date published
- 08/08/2000
- Academic Unit
- Chemical and Biochemical Engineering
- Record Identifier
- 9984221957202771
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