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Photopolymerization of silica-filled composites: Encapsulants for microelectronic devices.
Abstract   Peer reviewed

Photopolymerization of silica-filled composites: Encapsulants for microelectronic devices.

Alec B. Scranton, K. K. Baikerikar, V. Sipani and C N. Coretsopoulos
Abstracts of Papers of the American Chemical Society, Vol.222, p.488-POLY
08/01/2001

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Chemical Engineering

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